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光学仪器及设备
DRV-Z1人机工效学全高清FHD裸眼3D变倍观察
美国SONIX超声显微镜ECHO VS
发射扫描电子显微镜ReguluS
扫描电子显微镜FlexSEM 1000
扫描电子显微镜AeroSurf 15
场发射透射电子显微镜HF-3300
透射电子显微镜HT7800系列
球差校正扫描透射电子显微镜HD-2700
离子溅射仪MC1000
场发射扫描电镜热场式SU5000
测量/计量仪器
2D大视场测量显微镜TVM35
高精度光学测量显微镜Hawk Elite
工具测量显微镜Swift Pro Elite
尼康CNC影像测量VMZ-R3020
德国Werth三坐标测量机
Werth台式复合式光学三坐标测量机VideoCheck-IP
Werth台式复合式光学三坐标测量机ScopeCheck
Werth双频白光干涉白点测量传感器WIP
Werth自动寻边的测量机EasyScope 3D man
Werth高精度复合式光学三坐标VideoCheck IP Basic
制样/消解设备
Allied楔形电子显微镜制样夹具
Allied手工样品固定器
Allied自动磨抛机E-PREP 4™ (PH-4I™ )
Allied自动研磨抛光机MetPrep 3™
Allied自动研磨抛光机MetPrep
Allied自动注液机AD-5™
Allied双盘手动磨抛机TwinPrep 5™
Allied手动研磨抛光机MetPrep 1™
Allied手动研磨抛光机M-Prep 5™
Allied基材厚度测量仪X-PREP® VISION™
无损检测/无损探伤仪器
Werth计量型CT TomoScope L
Werth计量型CT TomoScope S
Werth计量型CT TomoScope S HA
Werth计量型CT TomoScope XL
Werth计量型CT TomoScope XL NC
Werth计量型CT TomoScope XS
尼康CT扫描工作站XTH450
尼康CT扫描工作站XTH225
尼康CT扫描工作站XTH320 LC
尼康X射线检测站XTV160
半导体行业专用仪器
化学开封机Elite Etch Cu ESD 7200
化学芯片开封机Elite Etch Cu 7100
化学芯片开封机Injector 7400
化学芯片开封机Mega Etch 7300
Nisene化学芯片开封机TotalProtect
Nisene化学芯片开封机JetEtch Pro
激光单粒子效应SEE测试仪
Nisene化学芯片开封机CuProtect
Nisene等离子芯片开封机PlasmaEtch
化学芯片开封机Elite Etch 7000
其他
布洛维通用硬度计DuraVision G5
洛式硬度计DuraJet G5
全自动显微维氏硬度计DuraScan G5
便携式齿轮洛式硬度计N7
便携式深孔内径硬度计N6P
相关仪表
Aberlink-Trimos关节臂坐标测量机
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产品系列
Board Level Acid Decapsulation System - with ESD
The Mega Etch operates at temperatures up to 250° C enabling operational versatility with any combination of acids. It includes the same functionality of all other RKD Engineering decapsulator models with additional features. This model improves upon the design of the Elite Etch series with an expanded decapsulation chamber and ESD mitigation. The expanded space surrounding the etch head allows a complete PCB to be prepared for failure analysis by using a gasket stack up with correct definitions cut. Maximum board size is 152.5 x 152.5 mm (6 x 6 in).
The Mega Etch features an acid controller etch head which is machined from premium grade silicon carbide for unsurpassed acid resistance. The etch head is designed to reduce the fuming of any residual acids left on the etch head at the end of the process, both for operator safety and convenient acid disposal.
The device hold-down assembly (ram nose) is a pneumatically activated push rod. The ram nose is normally retracted and extends when the safety cover is fully closed. The ram nose secures the sample package and a definition gasket to the etch head, thus eliminating movement of either the package or its fixturing. The ram nose is connected to a high impedance resistor network to further aid in ESD mitigation during decapsulation. The use of an electrically isolated, yet dissipative ram nose assembly ensures that the process of decapsulation never results in ESD problems within the part being opened.
RKD Engineering incorporates double containment for all fluid couplings between the bottle container and the decapsulator. The bottle box assembly and the etcher unit both contain fluid sensors to alert the operator in the event of an acid leak from any of the bottles or internal fittings. The bottle box incorporates a universal pivoting interconnect which allows simple bottle exchange with minimal exposure to residual acid.
To mitigate ESD problems when handling decapsulated packages on a board, including removal of the board from the decapsulator, rinsing, drying etc. The Mega Etch system is equipped with two ESD panel mounted sockets and circuitry for the attachment of ESD tweezers and a wrist strap. The unit however may be operated without appropriate grounding.
Specifications
Etcher Unit | Height: 431 mm (17 in) |
---|---|
Width: 330 mm (13 in) | |
Depth: 483 mm (19 in) | |
Bottle Assembly | Height: 254 mm (10 in) |
Width: 280 mm (11 in) | |
Depth: 127 mm (5 in) | |
Weight | Approx. 18 kg (40 lb) |
Power Source | 90 to 250 VAC, 50 to 60 Hz (4 amp) |
Acid temp. range | 10° to 250° C |
Acid temp. set point | 1° C ± 1% of setting |
Etch cavity (up to) | 22 mm x 22 mm (30 mm diagonal) for any packages mounted on or off a PCB. |
Maximum board size is 152.5 x 152.5 mm (6 x 6 in) | |
Choice of Acids | fuming nitric acids, mixed fuming nitric and sulfuric acids, or fuming/concentrated sulfuric acid |
Acid Mix Ratios | (nitric to sulfuric ratios) 9:1, 6:1, 5:1, 4:1, 7:2, 3:1, 5:2, 2:1, 3:2, 1:1, 1:2, 1:3, 1:4, 1:5 |
Post Etch Rinse Options | sulfuric acids, fuming nitric acids, mixed acids, or no rinse |
Etch Times | 1 to 2,400 seconds in 1 second increments (1 seconds to 40 minutes) dynamic (real time) adjustments of etch time |
Etch Modalities | Pulse Etch, Reciprocal Etch Acid Pulse (REAP) |
Temperature Ranges | 10° to 90° C (nitric acid), 20° to 250° C (sulfuric acid), 10° to 100° C (mixed acids) |
Etchant Volume Selection | 1 to 8 ml per minute - for all acids & acid mixes at a temperature above 100° C |
Operator Program Storage | 100 programs stored to nonvolatile memory |
Ambient Temperature Range | 15° to 26° C |
Warranty | most comprehensive and inclusive warranty in industry (ask for full details) |