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光学仪器及设备
DRV-Z1人机工效学全高清FHD裸眼3D变倍观察
美国SONIX超声显微镜ECHO VS
发射扫描电子显微镜ReguluS
扫描电子显微镜FlexSEM 1000
扫描电子显微镜AeroSurf 15
场发射透射电子显微镜HF-3300
透射电子显微镜HT7800系列
球差校正扫描透射电子显微镜HD-2700
离子溅射仪MC1000
场发射扫描电镜热场式SU5000
测量/计量仪器
2D大视场测量显微镜TVM35
高精度光学测量显微镜Hawk Elite
工具测量显微镜Swift Pro Elite
尼康CNC影像测量VMZ-R3020
德国Werth三坐标测量机
Werth台式复合式光学三坐标测量机VideoCheck-IP
Werth台式复合式光学三坐标测量机ScopeCheck
Werth双频白光干涉白点测量传感器WIP
Werth自动寻边的测量机EasyScope 3D man
Werth高精度复合式光学三坐标VideoCheck IP Basic
制样/消解设备
Allied楔形电子显微镜制样夹具
Allied手工样品固定器
Allied自动磨抛机E-PREP 4™ (PH-4I™ )
Allied自动研磨抛光机MetPrep 3™
Allied自动研磨抛光机MetPrep
Allied自动注液机AD-5™
Allied双盘手动磨抛机TwinPrep 5™
Allied手动研磨抛光机MetPrep 1™
Allied手动研磨抛光机M-Prep 5™
Allied基材厚度测量仪X-PREP® VISION™
无损检测/无损探伤仪器
Werth计量型CT TomoScope L
Werth计量型CT TomoScope S
Werth计量型CT TomoScope S HA
Werth计量型CT TomoScope XL
Werth计量型CT TomoScope XL NC
Werth计量型CT TomoScope XS
尼康CT扫描工作站XTH450
尼康CT扫描工作站XTH225
尼康CT扫描工作站XTH320 LC
尼康X射线检测站XTV160
半导体行业专用仪器
化学开封机Elite Etch Cu ESD 7200
化学芯片开封机Elite Etch Cu 7100
化学芯片开封机Injector 7400
化学芯片开封机Mega Etch 7300
Nisene化学芯片开封机TotalProtect
Nisene化学芯片开封机JetEtch Pro
激光单粒子效应SEE测试仪
Nisene化学芯片开封机CuProtect
Nisene等离子芯片开封机PlasmaEtch
化学芯片开封机Elite Etch 7000
其他
布洛维通用硬度计DuraVision G5
洛式硬度计DuraJet G5
全自动显微维氏硬度计DuraScan G5
便携式齿轮洛式硬度计N7
便携式深孔内径硬度计N6P
相关仪表
Aberlink-Trimos关节臂坐标测量机
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其主要工作原理是,通过压电陶瓷将电信号转换成超声波(>20KHz),用超声波对样品内部进行高精度地扫描,根据超声波在不同密度材料中的传播速度和反射系数的差异,获得样品内部不同区域的超声波透射或反射,再经由软件算法处理和成像。SAM的核心构成为,电气部件、机械装置、声学部件、软件系统。
SONIX ECHO VS™是专为更高精度要求,更复杂元器件设计的新一代设备。
广泛应用在 Flip chips,Stacked die,Bumped die,Bonded wafers 等。
● 高分辨率下,扫描速度是传统超声波扫描显微镜的2.5倍
● 独有的波形模拟器(Waveform Simulator)及波束仿真(Beam Emulator)
● 扫描分辨率小于1微米
● 水温控制系统及紫外杀菌系统超高频状态工作下,信号更稳定
To identify the smallest and most subtle defects in leading-edge packaged microelectronic applications, ECHO VS includes standard features such as heated water for optimum acoustic coupling, Flexible TAMI for efficient capture of the most useful data, Waveform Averaging for an improved signal-to-noise ratio, ICEBERG for improved image quality and MFCI for enhanced image quality in the most demanding applications. ECHO VS is the ultimate ultrasonic NDT equipment for molded flip chip, CSP, MCM, stacked die, MUF and other advanced packaging technologies.
Detects air defects as thin as 0.01 micron and spatially resolves defects down to 5 microns.
Image Enhancement Suite with heated water, waveform simulation and other innovations for industry-leading image quality in advanced packaging applications
Image optimization for improved image quality in complex molded flip chips (MUF) and packages with polyimide layers
Waveform averaging for improved signal-to-noise ratio
Transducers from 15MHz through 300MHz, designed and matched in-house to address all types of applications and materials
Stacked Die Imaging (SDI) (optional)
Molded Flip Chip Imaging (MFCI)