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光学仪器及设备
DRV-Z1人机工效学全高清FHD裸眼3D变倍观察
美国SONIX超声显微镜ECHO VS
发射扫描电子显微镜ReguluS
扫描电子显微镜FlexSEM 1000
扫描电子显微镜AeroSurf 15
场发射透射电子显微镜HF-3300
透射电子显微镜HT7800系列
球差校正扫描透射电子显微镜HD-2700
离子溅射仪MC1000
场发射扫描电镜热场式SU5000
测量/计量仪器
2D大视场测量显微镜TVM35
高精度光学测量显微镜Hawk Elite
工具测量显微镜Swift Pro Elite
尼康CNC影像测量VMZ-R3020
德国Werth三坐标测量机
Werth台式复合式光学三坐标测量机VideoCheck-IP
Werth台式复合式光学三坐标测量机ScopeCheck
Werth双频白光干涉白点测量传感器WIP
Werth自动寻边的测量机EasyScope 3D man
Werth高精度复合式光学三坐标VideoCheck IP Basic
制样/消解设备
Allied楔形电子显微镜制样夹具
Allied手工样品固定器
Allied自动磨抛机E-PREP 4™ (PH-4I™ )
Allied自动研磨抛光机MetPrep 3™
Allied自动研磨抛光机MetPrep
Allied自动注液机AD-5™
Allied双盘手动磨抛机TwinPrep 5™
Allied手动研磨抛光机MetPrep 1™
Allied手动研磨抛光机M-Prep 5™
Allied基材厚度测量仪X-PREP® VISION™
无损检测/无损探伤仪器
Werth计量型CT TomoScope L
Werth计量型CT TomoScope S
Werth计量型CT TomoScope S HA
Werth计量型CT TomoScope XL
Werth计量型CT TomoScope XL NC
Werth计量型CT TomoScope XS
尼康CT扫描工作站XTH450
尼康CT扫描工作站XTH225
尼康CT扫描工作站XTH320 LC
尼康X射线检测站XTV160
半导体行业专用仪器
化学开封机Elite Etch Cu ESD 7200
化学芯片开封机Elite Etch Cu 7100
化学芯片开封机Injector 7400
化学芯片开封机Mega Etch 7300
Nisene化学芯片开封机TotalProtect
Nisene化学芯片开封机JetEtch Pro
激光单粒子效应SEE测试仪
Nisene化学芯片开封机CuProtect
Nisene等离子芯片开封机PlasmaEtch
化学芯片开封机Elite Etch 7000
其他
布洛维通用硬度计DuraVision G5
洛式硬度计DuraJet G5
全自动显微维氏硬度计DuraScan G5
便携式齿轮洛式硬度计N7
便携式深孔内径硬度计N6P
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Aberlink-Trimos关节臂坐标测量机
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PlasmaEtch Process - 美国**9,548,227 B2 - 使用等离子体放电管的微波诱导等离子体。 微波诱导式等离子芯片开封系统 ---- PlasmaEtch
无论是传统的金线样品,还是样品都采用铜线或银线,PlasmaEtch都能提供安全可靠的蚀刻。
As the world moves toward more eco-friendly processes and the semiconductor manufacturing industry continues to make smaller parts with sensitive internal components, failure analysts are presented with a unique challenge: how do you etch these samples? Nisene Technology Group has bridged the gap between semiconductor manufacturing technology and failure analysis with its latest decapsulation system: the PlasmaEtch.
工作原理:
The PlasmaEtch decapsulation system is a revolutionary patent-pending gas-based semiconductor etching system. Employing a never-before-seen application of microwaved gases inciting chemical radicals for isotropic etching, the PlasmaEtch is the greenest and most cost-effective etching solution available. The PlasmaEtch can etch most sample sizes, encapsulant types, and wire bond types. Whether it’s a more traditional gold wire sample, or if the sample features copper or silver wires, the PlasmaEtch delivers a safe and reliable etch.
PlasmaEtch创新点:
Afterburner Downstream Focused Plasma Etching(延时激发下行聚焦离子蚀刻)
Mass Flow Controlling for All Gases(所有气体流量可控)
No Microwave Radiation Exposure to Samples During Etch Process(无微波辐射)
Low Temperature Etching(低温蚀刻)
Isotropic Etching(等向性蚀刻)
Unlike typical and less sophisticated plasma decap systems that take many hours or even days to get to the surface of the die, the PlasmaEtch can clear the encapsulant of most package types and reveal the complete die surface and wire sweep in a matter of a couple hours. Chemical-free decapsulation has never been so effective.
主要特色(Highlights):
Highly Customizable Etch Recipes(高度可定制的蚀刻配方)Etches a Wide Variety of Package Types(可蚀刻各种各样的封装类型)Completely Chemical-free Decap(完全非化学方式蚀刻)Eco-friendly(生态友好环保)Touchscreen Interface(触控屏)PC/Windows-based GUI(基于PC / Windows的GUI)The Only Solution for Silver Wires(银线的**解决方案)